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Commit graph kernel_a52xq/include/linux/cpu_cooling.h
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treewide: import latest Galaxy A52 5G kernel
* this imports the latest version of SM-A526B kernel from https://opensource.samsung.com/uploadSearch?searchValue=SM-A526B

itsaschoolbus   commited 2026-09-27 19:03:59 +07:00
34794f4cb2
ANDROID: GKI: drivers: cpu_cooling: allow platform freq mitigation
Allow platform drivers to register with CPU cooling with their frequency
mitigation functions. This allows the platform drivers to provide the
callbacks to get the current ceil limit and to set the floor and ceil
limits for the cpu.

Change-Id: I47960b002bf1bce1cd588de2892de46793a95562
Signed-off-by: Lina Iyer <ilina@codeaurora.org>
(cherry picked from commit 986fde1710c194bede83bf62eb542e6f05af3886)
Signed-off-by: Mark Salyzyn <salyzyn@google.com>
Bug: 154153737

Lina Iyer   authored and   Mark Salyzyn   commited 2020-04-17 03:23:39 +00:00
e92e4035e0
cpu_cooling: Drop static-power related stuff
No one has used it for the last two and half years (since it was
introduced by commit c36cf07176 (thermal: cpu_cooling: implement the
power cooling device API), get rid of it.

Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Viresh Kumar   authored and   Rafael J. Wysocki   commited 2017-12-07 22:52:01 +01:00
84fe2cab48
cpu_cooling: Keep only one of_cpufreq*cooling_register() helper
of_cpufreq_cooling_register() isn't used by anyone and so can be
removed, but then we would be left with two routines:
cpufreq_cooling_register() and of_cpufreq_power_cooling_register() that
would look odd.

Remove current implementation of of_cpufreq_cooling_register() and
rename of_cpufreq_power_cooling_register() as
of_cpufreq_cooling_register(). This simplifies lots of stuff.

Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Viresh Kumar   authored and   Rafael J. Wysocki   commited 2017-12-07 22:52:01 +01:00
3ebb62ffc4
cpu_cooling: Remove unused cpufreq_power_cooling_register()
It isn't used by anyone, drop it.

Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Viresh Kumar   authored and   Rafael J. Wysocki   commited 2017-12-07 22:52:01 +01:00
ba0966da20
cpu_cooling: Make of_cpufreq_power_cooling_register() parse DT
All the callers of of_cpufreq_power_cooling_register() have almost
identical code and it makes more sense to move that code into the helper
as its all about reading DT properties.

This got rid of lot of redundant code.

Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Viresh Kumar   authored and   Rafael J. Wysocki   commited 2017-12-07 22:52:01 +01:00
f5f263fed6
thermal: cpu_cooling: use cpufreq_policy to register cooling device
The CPU cooling driver uses the cpufreq policy, to get clip_cpus, the
frequency table, etc. Most of the callers of CPU cooling driver's
registration routines have the cpufreq policy with them, but they only
pass the policy->related_cpus cpumask. The __cpufreq_cooling_register()
routine then gets the policy by itself and uses it.

It would be much better if the callers can pass the policy instead
directly. This also fixes a basic design flaw, where the policy can be
freed while the CPU cooling driver is still active.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Viresh Kumar   authored and   Eduardo Valentin   commited 2017-05-27 17:32:24 -07:00
4d753aa7b6
thermal: cpu_cooling: remove cpufreq_cooling_get_level()
There is only one user of cpufreq_cooling_get_level() and that already
has pointer to the cpufreq_cdev structure. It can directly call
get_level() instead and we can get rid of cpufreq_cooling_get_level().

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Viresh Kumar   authored and   Eduardo Valentin   commited 2017-05-27 17:32:04 -07:00
3e08b2df12
thermal: cpu_cooling: implement the power cooling device API
Add a basic power model to the cpu cooling device to implement the
power cooling device API.  The power model uses the current frequency,
current load and OPPs for the power calculations.  The cpus must have
registered their OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Javi Merino   authored and   Eduardo Valentin   commited 2015-05-04 21:27:52 -07:00
c36cf07176
thermal: cpu_cooling: return ERR_PTR() for !CPU_THERMAL or !THERMAL_OF
The documentation of of_cpufreq_cooling_register() and
cpufreq_cooling_register() say that they return ERR_PTR() on error.
Accordingly, callers only check for IS_ERR().  Therefore, make them
return ERR_PTR(-ENOSYS) as is customary in the kernel when config
options are missing.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Javi Merino   authored and   Eduardo Valentin   commited 2014-12-17 09:00:04 -04:00
503ccc3fec
thermal: cpu_cooling: introduce of_cpufreq_cooling_register
This patch introduces an API to register cpufreq cooling device
based on device tree node.

The registration via device tree node differs from normal
registration due to the fact that it is needed to fill
the device_node structure in order to be able to match
the cooling devices with trip points.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

Eduardo Valentin   commited 2013-12-04 09:33:34 -04:00
39d99cff76
thermal: cpu_cooling: fix stub function
The function stub for cpufreq_cooling_get_level introduced
in 57df81069 "Thermal: exynos: fix cooling state translation"
is not syntactically correct C and needs to be fixed to avoid
this error:

In file included from drivers/thermal/db8500_thermal.c:20:0:
 include/linux/cpu_cooling.h: In function 'cpufreq_cooling_get_level':
include/linux/cpu_cooling.h:57:1:
 error: parameter name omitted  unsigned long cpufreq_cooling_get_level(unsigned int, unsigned int)  ^
 include/linux/cpu_cooling.h:57:1: error: parameter name omitted

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Amit Daniel kachhap <amit.daniel@samsung.com>
Cc: stable@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

Arnd Bergmann   authored and   Eduardo Valentin   commited 2013-07-08 10:13:40 -04:00
e8d39240d6
thermal: cpu_cooling: improve line breaking
To improve code readiness, change the way the lines
are broken in this file.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Eduardo Valentin   authored and   Zhang Rui   commited 2013-04-27 09:25:59 +08:00
d44ada5162
thermal: cpu_cooling: remove unused symbols on cpu_cooling.h
Remove defines that are not in used.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Eduardo Valentin   authored and   Zhang Rui   commited 2013-04-25 00:34:45 +08:00
e44dec77be
thermal: cpu_cooling: add needed header for cpu_cooling.h
Update header list for cpu_cooling.h. Missing definition of cpumask.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Eduardo Valentin   authored and   Zhang Rui   commited 2013-04-25 00:34:44 +08:00
198f38f7fb
Thermal: build cpu_cooling code into thermal_sys module
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>

Zhang Rui   commited 2013-04-14 23:28:49 +08:00
bbf7fc88c7
Thermal: exynos: fix cooling state translation
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>

Zhang Rui   commited 2013-03-26 14:33:50 +08:00
57df810693
thermal: cpu cooling: allow module builds
As thermal drivers can be built as modules and also
the thermal framework itself, building cpu cooling
only as built-in can cause linking errors. For instance:
* Generic Thermal sysfs driver
*
Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m
  generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y

with the following drive:
CONFIG_OMAP_BANDGAP=m

generates:
ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!
ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!

This patch changes cpu cooling driver to allow it
to be built as module.

Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Eduardo Valentin   authored and   Zhang Rui   commited 2012-11-22 15:59:52 +08:00
4ba115b1e1
thermal: cpu cooling: use const parameter while registering
There are predefined cpu_masks that are const data structures.
This patch changes the cpu cooling register function so that
those const cpu_masks can be used, without compilation warnings.

include/linux/cpumask.h

 * The following particular system cpumasks and operations manage
 * possible, present, active and online cpus.
 *
 *     cpu_possible_mask- has bit 'cpu' set iff cpu is populatable
 *     cpu_present_mask - has bit 'cpu' set iff cpu is populated
 *     cpu_online_mask  - has bit 'cpu' set iff cpu available to scheduler
 *     cpu_active_mask  - has bit 'cpu' set iff cpu available to migration
 *

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Eduardo Valentin   authored and   Zhang Rui   commited 2012-11-22 15:59:47 +08:00
3778ff5c70
thermal: add generic cpufreq cooling implementation
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <----->  Exynos thermal interface <----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

Amit Daniel Kachhap   authored and   Zhang Rui   commited 2012-09-24 14:44:38 +08:00
0236141837