Repository files (latest commit first)

Filename	Latest commit message	Latest commit date
Anton Tikhomirov d28a9689c9 usb: dwc3: Add Exynos Specific Glue layer ... Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com>		2012-03-02 12:11:28 +02:00
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dwc3-exynos.h	usb: dwc3: Add Exynos Specific Glue layer	2012-03-02 12:11:28 +02:00
dwc3-omap.h	usb: dwc3: omap: distinguish between SW and HW modes	2011-09-09 13:02:45 +03:00
exynos4_tmu.h	hwmon: Add driver for EXYNOS4 TMU	2011-10-24 11:09:35 -07:00
fsa9480.h	drivers/misc: add support the FSA9480 USB Switch	2011-07-25 20:57:14 -07:00
leds-renesas-tpu.h	drivers/leds/leds-renesas-tpu.c: move Renesas TPU LED driver platform data	2011-10-31 17:30:55 -07:00
macb.h	ARM: at91/boards: use -EINVAL for invalid gpio	2011-11-29 15:46:14 +00:00
msm_serial_hs.h
mv_usb.h	USB: EHCI: Add Marvell Host Controller driver	2011-12-20 12:58:13 +02:00
ntc_thermistor.h	doc: fix broken references	2011-09-27 18:08:04 +02:00
pxa_sdhci.h
s3c-hsudc.h	usb: gadget: s3c-hsudc: move platform_data struct to global header	2011-12-21 13:24:27 +02:00
tegra_usb.h
uio_pruss.h