Message	SHA1
usb: dwc3: Add Exynos Specific Glue layer ... Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> Anton Tikhomirov   authored and   Felipe Balbi   commited 2012-03-02 12:11:28 +02:00	d28a9689c9